• Caddock

Caddock CD2015FC Series

  • Low resistance precision flip-chip surface-mount resistor
  • Utilises the proven Caddock Micronoxยฎ resistance films to achieve the unique low resistance range
  • Pedestal terminal design helps maintain precision and its copper core provides heat spreading which enhances the high power handling capabilities
  • Chip size of 2015
  • Bare ceramic back surface
  • Inductance of less than 5nH typical
  • Maximum chip temperature of +150ยฐC
  • Temperature range of -55ยฐC to +150ยฐC
  • Caddock

Caddock CD2015WBA Series

  • Low resistance precision wire-bondable surface-mount resistor
  • Utilises the proven Caddock Micronoxยฎ resistance films to achieve the unique low resistance range
  • Pedestal terminal design helps maintain precision and its copper core provides heat spreading which enhances the high power handling capabilities
  • Chip size of 2015
  • Aluminium wire to be used for bonding
  • Inductance of less than 5nH typical
  • Maximum chip temperature of +150ยฐC
  • Temperature range of -55ยฐC to +150ยฐC
  • Caddock

Caddock CD2520FC Series

  • Low resistance precision flip-chip surface-mount resistor
  • Utilises the proven Caddock Micronoxยฎ resistance films to achieve the unique low resistance range
  • Pedestal terminal design helps maintain precision and its copper core provides heat spreading which enhances the high power handling capabilities
  • Chip size of 2520
  • Bare ceramic back surface
  • Inductance of less than 5nH typical
  • Maximum chip temperature of +150ยฐC
  • Temperature range of -55ยฐC to +150ยฐC
  • Caddock

Caddock CD2520WBA Series

  • Low resistance precision wire-bondable surface-mount resistor
  • Utilises the proven Caddock Micronoxยฎ resistance films to achieve the unique low resistance range
  • Pedestal terminal design helps maintain precision and its copper core provides heat spreading which enhances the high power handling capabilities
  • Chip size of 2520
  • Aluminium wire to be used for bonding
  • Inductance of less than 5nH typical
  • Maximum chip temperature of +150ยฐC
  • Temperature range of -55ยฐC to +150ยฐC

Caddock CD2015FC Series

  • Low resistance precision flip-chip surface-mount resistor
  • Utilises the proven Caddock Micronoxยฎ resistance films to achieve the unique low resistance range
  • Pedestal terminal design helps maintain precision and its copper core provides heat spreading which enhances the high power handling capabilities
  • Chip size of 2015
  • Bare ceramic back surface
  • Inductance of less than 5nH typical
  • Maximum chip temperature of +150ยฐC
  • Temperature range of -55ยฐC to +150ยฐC

Caddock CD2015WBA Series

  • Low resistance precision wire-bondable surface-mount resistor
  • Utilises the proven Caddock Micronoxยฎ resistance films to achieve the unique low resistance range
  • Pedestal terminal design helps maintain precision and its copper core provides heat spreading which enhances the high power handling capabilities
  • Chip size of 2015
  • Aluminium wire to be used for bonding
  • Inductance of less than 5nH typical
  • Maximum chip temperature of +150ยฐC
  • Temperature range of -55ยฐC to +150ยฐC

Caddock CD2520FC Series

  • Low resistance precision flip-chip surface-mount resistor
  • Utilises the proven Caddock Micronoxยฎ resistance films to achieve the unique low resistance range
  • Pedestal terminal design helps maintain precision and its copper core provides heat spreading which enhances the high power handling capabilities
  • Chip size of 2520
  • Bare ceramic back surface
  • Inductance of less than 5nH typical
  • Maximum chip temperature of +150ยฐC
  • Temperature range of -55ยฐC to +150ยฐC

Caddock CD2520WBA Series

  • Low resistance precision wire-bondable surface-mount resistor
  • Utilises the proven Caddock Micronoxยฎ resistance films to achieve the unique low resistance range
  • Pedestal terminal design helps maintain precision and its copper core provides heat spreading which enhances the high power handling capabilities
  • Chip size of 2520
  • Aluminium wire to be used for bonding
  • Inductance of less than 5nH typical
  • Maximum chip temperature of +150ยฐC
  • Temperature range of -55ยฐC to +150ยฐC